The AI-Thinker ESP32-S is a highly integrated, ultra-low-power Wi-Fi and Bluetooth combo module designed for surface-mount (SMD) integration. Engineered around the powerful ESP32 chip, it houses a dual-core 32-bit Xtensa LX6 microprocessor operating at up to 240 MHz. This standalone module is the industry choice for advanced engineering students, industrial product developers, and automated hardware designers who are transitioning from a breadboard prototype to a finalized custom PCB layout.
Industrial SMD Design: Compact stamp-hole pattern layout, perfect for automated pick-and-place assembly or manual precise soldering on custom PCBs.
Dual-Core Processing: Massive processing power with independent core management for handling heavy communication protocols and sensor readouts concurrently.
Hybrid Wireless Connectivity: Combines high-speed 2.4GHz Wi-Fi (802.11 b/g/n) with Bluetooth v4.2 BR/EDR and BLE for long-range IoT networks.
Shielded Reliability: Covered by an official metal casing to prevent electromagnetic interference (EMI) and ensure regulatory compliance in commercial electronics.
| Feature | Specification |
| Manufacturer | AI-Thinker |
| Processor | Xtensa Dual-Core 32-bit LX6 Microprocessor (up to 240MHz) |
| Flash Memory | 4 MB SPI Flash |
| SRAM | 520 KB Internal SRAM |
| Wireless Protocol | Wi-Fi 802.11 b/g/n + Bluetooth 4.2 BR/EDR & BLE |
| Antenna Type | On-board PCB Trace Antenna |
| Operating Voltage | 3.0V to 3.6V DC (Ideal: 3.3V) |
| Operating Current | Average: 80mA |
| Peripherals | UART, SPI, I2C, PWM, I2S, ADC, DAC, Touch Sensors |
| Dimensions | 25.5mm x 18.0mm x 3.1mm |
Custom PCB Manufacturing: The standard module chosen for manufacturing customized home automation, smart agriculture systems, and telemetry devices.
Smart Wearables: Extremely low-profile footprint fits inside small enclosures.
IP Cameras & Audio Streaming: Capable of high-speed data throughput via integrated Wi-Fi protocols.
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