Vishay Discreet Semiconductor Part #SIHK045N60E-T1-GE3 | Semiconductor | DEX

Vishay Discreet Semiconductor Part #SIHK045N60E-T1-GE3

The PowerPAK 1212-8 has a footprint area comparable to TSOP-6. It is over 40 % smaller than standard TSSOP-8. Its die capacity is more than twice the size of the standard TSOP-6s. It has thermal performance an order of magnitude better than the SO-8, and 20 times better than TSSOP-8. Its thermal performance is better than all current SMT packages in the market. It will take the advantage of any PC board heat sink capability. Bringing the junction temperature down also increases the die efficiency by around 20 % compared with TSSOP-8. For applications where bigger packages are typically required solely for thermal consideration, the PowerPAK 1212-8 is a good option. Both the single and dual PowerPAK 1212-8 utilize the same pin-outs as the single and dual PowerPAK SO-8. The low 1.05 mm PowerPAK height profile makes both versions an excellent choice for applications with space constraints

Features:

• 4th generation E series technology
• Low figure-of-merit (FOM) Ron x Qg
• Low effective capacitance (Co(er))
• Reduced switching and conduction losses
• Avalanche energy rated (UIS)

Applications:

• Server and telecom power supplies
• Switch mode power supplies (SMPS)
• Power factor correction power supplies (PFC)
• Lighting
• High-intensity discharge (HID)
• Fluorescent ballast lighting
• Industrial
• Welding
• Induction heating
• Motor drives
• Battery chargers
• Solar (PV inverters

VSH:SIHK045N60E-T1-GE3

SIHK045N60E-T1-GE3