The Thermal Pads 12x12x1.5mm are high-performance thermal interface materials designed to bridge gaps between heat-generating components and heat sinks, enhancing heat dissipation and device longevity. These pads offer excellent thermal conductivity and easy application, making them an ideal choice for electronic cooling solutions.
| Parameter | Details |
|---|---|
| Material | Silicone-based thermal interface material |
| Dimensions | 12mm x 12mm x 1.5mm |
| Thermal Conductivity | 6.0 W/mK (0.5 W/mK) |
| Operating Temperature | -40C to +200C |
| Electrical Insulation | Yes |
| Compression Ratio | 10-20% |
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