The Mechanic MCN-300 is a high-performance soldering flux paste packaged in a convenient 35g tin. It is engineered to provide superior wetting (the ability of liquid solder to bond to metal), making it indispensable for high-density circuit boards. Its No-Clean property means it leaves behind minimal, non-corrosive residue that wont interfere with your circuits signals, saving you time on the cleaning bench.
High Insulation Resistance: Specifically formulated to prevent electrical leakage on sensitive mobile phone motherboards and ICs.
Low Smoke & Odor: Designed for a more comfortable working environment during long repair sessions.
Instant De-oxidation: Chemically strips away oxide layers from copper pads and component pins for a perfect bond in milliseconds.
Wide Compatibility: Works perfectly with leaded ($60/40$), lead-free, and low-temperature solder alloys.
Smooth Viscosity: The paste has a buttery consistency that is easy to apply with a toothpick or spatula without being too runny.
| Feature | Specification |
| Brand | Mechanic (Original) |
| Model | MCN-300 |
| Net Weight | 35 Grams |
| Type | Rosin-Based / No-Clean |
| PH Value | Neutral (Non-Corrosive) |
| Application | BGA, SMD, SMT, Smartphone & Laptop Repair |
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