Hoki Solder Paste FS50 Sn63 Pb37

The FS50 Sn63 Pb37 Solder Paste is a premium-quality soldering solution designed for precision electronics assembly. This eutectic solder paste, containing 63% tin (Sn) and 37% lead (Pb), provides excellent wetting properties, superior joint strength, and consistent performance in both manual and automated soldering processes.

Features

• Eutectic Composition (Sn63/Pb37): Ensures a sharp melting point at 183C for reliable soldering.
• Excellent Wettability: Provides uniform coverage and strong adhesion to components and PCB pads.
• Superior Printability: Smooth and consistent application suitable for fine-pitch components.
• Long Shelf Life: Stable formulation ensures performance over extended storage.
• Low Voiding: Minimizes voids in solder joints, enhancing durability and conductivity.

Applications

• PCB Assembly: Ideal for SMT (Surface Mount Technology) soldering.
• Reflow Soldering: Compatible with modern reflow ovens for consistent results.
• Repair and Prototyping: Perfect for touch-ups and prototyping in electronics manufacturing.
• Fine-Pitch Components: Suitable for BGA, QFP, and other small-pitch packages.

Specification